Chip selection recommendation

Yunux

Hello, I'm a student planning a smart wearable device project based on Bluetooth 6.0. I'm not very familiar with this chip, so I would greatly appreciate your suggestion. Could you recommend a suitable chip for this type of project and explain your reasons?


In my proposal, I mentioned the TL721X series, but I'd love to learn more and consider other options. Thank you very much!

TL_Cindy

For a student Bluetooth 6.0 smart wearable project, the TL721x family is the best fit in Telink’s current lineup, and your initial choice is very much on target.

If you prefer to avoid RF layout and antenna tuning in a student project, consider the ML7218X modules, which are based on TL721x:

ML7218D1‑MERCURY‑M0‑PE11: compact module with 20 GPIOs.

ML7218A‑GAIA‑M0‑PE11: larger module offering 47 GPIOs for greater flexibility.

Other Recommended Options：

TLSR922x (TLSR9228H) – also Bluetooth 6.0 and multi‑protocol (BLE, Mesh, Zigbee Pro 2023, Thread, Matter, etc.).

TLSR951x / TLSR952x – dual‑mode (Classic + LE) or audio‑focused SoCs. They are great for wireless headsets or audio‑heavy wearables, but their main advantage is advanced audio (ANC/ENC, LE Audio, Classic Audio) rather than generic sensor‑centric smart bands/watches.

Yunux

TL_Cindy 发表于 2026-1-20 10:22
For a student Bluetooth 6.0 smart wearable project, the TL721x family is the best fit in Telink’s c ...

Okay, Thanks

Yunux

TL_Cindy 发表于 2026-1-20 10:22
For a student Bluetooth 6.0 smart wearable project, the TL721x family is the best fit in Telink’s c ...

Hi Cindy,
We recently placed an order for the TL721x family development board kit, but later found out that the Bluetooth 6.0 stack is not yet available for this board.
Based on your previous recommendation, you suggested the ML7218D1-MERCURY-M0-PE11 module or the ML7218A-GAIA-M0-PE11 (larger module). However, I noticed that choosing either of these options would require some additional work on our side, such as power step-down design and soldering which I'm not so familiar with.
I also saw that these modules have their own development board kits. Could you please let me know whether using the module board kit would be flexible enough for our intended work and testing?

Additionally, in the Telink IoT Studio Quick Guide
(https://doc.telink-semi.cn/doc/e ... _Studio_User_Guide/
), I couldn’t find clear instructions on how to start and compile a new project. I’d appreciate it if you could point me to the correct section or provide some guidance on this. I really need someone that can speak English to support me.
Thank you very much for your support.

TL_long

There is a dedicated development platform for the ML7218x modules called the AIOT-DK1. This is described as a specialized development platform tailored for Telink modules, enabling flexible integration of both the ML7218D1-MERCURY-M0-PE11 (small module) and the ML7218A-GAIA-M0-PE11 (large module). [https://doc.telink-semi.cn/doc/en/hardware/res/module/aiot_dk1/]

The AIOT-DK1 motherboard supports:
1. On-board burning (firmware flashing via USB)
2. Combined use with peripheral submodules (LCD module, CODEC module, camera)
3. Power supply via USB Type-C
This means you would not need to design your own power step-down circuit or do complex soldering — you simply plug the module into the AIOT-DK1 motherboard. [https://doc.telink-semi.cn/doc/e ... DK1/AIOT-DK1_ug_en/]

For software, the AIOT-DK1 works with the tl_platform_sdk (version v3.5.0 or higher), and firmware can be burned directly via the Telink BDT tool over USB. [https://doc.telink-semi.cn/doc/e ... DK1/AIOT-DK1_ug_en/]

The user manual for the AIOT-DK1 can be downloaded here: https://doc.telink-semi.cn/doc/h ... DK1_User_Manual.pdf

For questions about creating and compiling projects, please post them in the software section for more accurate answers. Thank you.